Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, has announced its entry into the field of silicon photonics with the imminent launch of its new on-chip optical interconnect technology called COUPE (Copper Orthogonal Unified Physical Layer and Electrical). COUPE is designed to address the ever-increasing demand for high-speed and low-power data transmission within integrated circuits.
COUPE Technology Overview
COUPE technology leverages the advantages of silicon photonics to enable optical interconnects on-chip. By using silicon as the base material, COUPE offers benefits such as reduced power consumption, enhanced signal integrity, and reduced latency compared to traditional copper interconnects. COUPE incorporates a waveguide structure fabricated on the silicon substrate, guiding light signals between different on-chip components.
Key Features
* Data rates up to 12.8 Tbps
* Low power consumption
* Reduced latency
* Improved signal integrity
* Compact design
Applications
COUPE technology is expected to find applications in various high-performance computing scenarios, such as:
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Benefits for TSMC and the Industry
TSMC’s entry into silicon photonics demonstrates its commitment to innovation and technology leadership. By offering COUPE technology to its customers, TSMC aims to enable next-generation chip designs with improved efficiency and performance. The wider industry is expected to benefit from the availability of a commercially viable on-chip optical interconnect solution.
Conclusion
TSMC’s unveiling of COUPE technology is a significant development in the semiconductor industry. By embracing silicon photonics, TSMC provides a crucial solution to address the challenges of high-speed and low-power data transmission on-chip. COUPE technology is expected to drive innovation in chip design and pave the way for future advancements in computing and networking.
Kind regards
B. Horn
