JEDEC, the semiconductor engineering standardization body, has released two new standards for memory modules: JESD288-03 for CAMM (Compression Attached Memory Module) and JESD289-02 for MRDIMM (Memory Rank DIMM). These standards define the electrical, mechanical, and thermal specifications for these new types of memory modules.
CAMM: A New Form Factor for LPDDR6 Memory
CAMM is a new form factor for LPDDR6 memory that is designed to be more compact and efficient than traditional DIMMs. CAMM modules are smaller than DIMMs, and they use a new compression technology that allows them to store more data in a smaller space. This makes CAMM modules ideal for use in space-constrained applications such as laptops and tablets.
Benefits of CAMM
* Smaller and more compact than traditional DIMMs
* Uses compression technology to store more data in a smaller space
* Ideal for use in space-constrained applications such as laptops and tablets
MRDIMM: A New Type of DDR5 Memory Module
MRDIMM is a new type of DDR5 memory module that is designed to improve performance and reliability. MRDIMMs use a new architecture that allows them to access data more quickly and efficiently than traditional DIMMs. They also have built-in error correction capabilities that help to improve reliability.
Benefits of MRDIMM
* Improved performance and reliability
* Faster data access speeds
* Built-in error correction capabilities
Conclusion
The new CAMM and MRDIMM standards from JEDEC are a significant step forward for the memory industry. These new standards will enable the development of more compact, efficient, and reliable memory modules that can meet the demands of next-generation computing applications.
Kind regards B. Horn
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